三星和博通扩大战略合作
三星电子和博通已签署谅解备忘录，以扩大在下一代AI基础设施领域的合作，包括前沿内存、代工技术以及先进封装技术。
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- SSamsung Semiconductor News公司披露2026-07-25 22:10
SAN JOSE, Calif., and SEOUL, Korea – July 25, 2026 – Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastru…
- SSamsung Semiconductor News公司披露2026-07-25 22:10
“AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging,” said Young Hyun Jun, Vice Chairman & CEO of the Device Solutions (DS) Division at Samsung Electronics. “By expanding our collaboration with Broad…