Samsung Electronics and Broadcom have signed a memorandum of understanding to broaden their collaboration on next-generation AI infrastructure, including leading-edge memory, foundry technologies, and advanced packaging.
SAN JOSE, Calif., and SEOUL, Korea – July 25, 2026 – Samsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastru…
“AI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging,” said Young Hyun Jun, Vice Chairman & CEO of the Device Solutions (DS) Division at Samsung Electronics. “By expanding our collaboration with Broad…
