TSMC and GlobalFoundries sign $2B agreement for silicon interposer manufacturing in Malta, New York

TSMC and GlobalFoundries have signed a $2 billion manufacturing agreement under which GlobalFoundries will produce silicon interposers for TSMC's CoWoS advanced packaging ecosystem at its Malta, New York fab, with volume production expected to ramp in the first half of 2028.

Why it matters. This agreement strengthens the advanced packaging supply chain for high-performance computing and AI chips, directly supporting TSMC's CoWoS technology which is critical for next-generation accelerators and data center processors.