GlobalFoundries to produce silicon interposers for TSMC in New York under $2 billion deal

GlobalFoundries has signed a five-year, $2 billion agreement with TSMC to manufacture silicon interposers for TSMC's CoWoS advanced packaging at its Malta, New York fab. Volume production is expected to begin in the first half of 2028, establishing the site as the first US base for this critical advanced packaging component.

Why it matters. This expands US-based advanced packaging capacity, reducing reliance on overseas production and strengthening supply chain resilience for AI and high-performance computing chips.