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Samsung to use TSMC's 3nm process for Nvidia's next-generation HBM base diesAI illustration
DevelopingTechnologyIndustryMarketsReported 2026-10-18 22:30

Samsung to use TSMC's 3nm process for Nvidia's next-generation HBM base dies

Samsung Electronics will use TSMC's 3-nanometre process to produce base dies for Nvidia's next-generation custom high-bandwidth memory (HBM) chips, marking the first time Samsung works with TSMC at the HBM manufacturing stage, according to a report by Seoul Economic Daily citing industry sources.

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Why it matters. This development affects semiconductor supply chains and advanced memory production, as it involves a major foundry collaboration between Samsung and TSMC for Nvidia's AI-focused memory technology.

01

Who and what it touches

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From Samsung Electronics

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02

Evidence

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